Exploring carbon nanotubes and NiSi nanowires as on-chip interconnections
Chen Dong,S. Haruehanroengra,Wei Wang
2006 · DOI: 10.1109/ISCAS.2006.1693383
引用数 11
TLDR
NiSi nanowire has superior properties in terms of effective current density and propagation speed compared to Cu and CNT, which makes it the most promising candidate for future on-chip interconnections.
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