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Exploring carbon nanotubes and NiSi nanowires as on-chip interconnections

Chen Dong,S. Haruehanroengra,Wei Wang

2006 · DOI: 10.1109/ISCAS.2006.1693383
引用数 11

TLDR

NiSi nanowire has superior properties in terms of effective current density and propagation speed compared to Cu and CNT, which makes it the most promising candidate for future on-chip interconnections.

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